The UP Xtreme i12 developer board is a powerful next-generation platform equipped with 12th/13th Gen Intel® Core™ processors, boasting a 12-core, 16-thread hybrid architecture for enhanced energy efficiency and performance. This innovative design offers up to 20% more CPU performance compared to its predecessor, Tiger Lake, making it an ideal solution for industrial applications such as smart manufacturing. With a wide power input range of 12~36V, the UP Xtreme i12 can operate reliably in demanding environments, ensuring consistent performance in extended use cases.
The board is designed for faster data processing and high-speed connectivity, featuring up to 32GB of onboard LPDDR5 memory, which doubles bandwidth and memory capacity. This, combined with 2.5GbE ports and USB 4.0, allows for seamless connections to peripherals like cameras and sensors, making it suitable for applications in smart retail and other AI-driven solutions. The board’s Intel® Iris® Xe graphics deliver a 2.47x boost in graphics speed and support up to four simultaneous 4K displays, providing exceptional visual capabilities for complex workloads.
The UP Xtreme i12 also excels in expandability and AI performance, supporting Wi-Fi 6, 5G, and PCIe 4.0 via multiple M.2 slots. With Intel® DL Boost and the OpenVINO™ toolkit, the board offers up to 2.81x better GPU image classification inference performance compared to previous generations, making it a top choice for AI, IoT, and robotics projects. Time Sensitive Networking (TSN) via Intel® i226IT Ethernet ensures precise real-time processing, solidifying the UP Xtreme i12 as an elite solution for demanding, high-performance industrial and AI applications.
UPX-RAPI7-A11-1600,UPX-RAPI7-A11-1600,UPX-RAPı7-A11-1600,UPX-RAPi7-A11-1600,UPX-RAPİ7-A11-1600,UP XTREME I12,Industrial Motherboard,UP,UP Board,NULL,NULL,NULLProduct Code | UPX-RAPI7-A11-1600 |
Card Size (mm) | |
Video Input | HDMI 2.0b x 1, DP 1.4a x 1, DP 1.4a x 1 (via USB Type-C), eDP 1.4b x 9 |
Processor [CPU] | Intel® Core™ i7-13700TE 16 Core 1.10 / 4.80 GHz | BM : 23110 |
Processor [CPU] Family | Intel® Core™ i7 13. Gen |
RAM [System Memory] | 16 GB |
SSD/HDD/mSATA/M.2 | M.2 2280 M-Key x 2 (PCIe Gen 4.0 [x4]) | SATA 6 GB/s x 1 |
LAN/Ethernet | x 2 |
USB 3.2 | x 3 |
USB 2.0 | x 1 |
RS 232/422/485 Serial Port | RS-232/422/485 10-pin header x 10 |
Video Output | HDMI 2.0b x 1, DP 1.4a x 1, DP 1.4a x 1 (via USB Type-C), eDP 1.4b x 9 |
Audio Output | Mic-in x 1 + Line-out x 1 |
Expansion Slot | 40-pin GPIO x 1M.2 2230 E-Key x 1M.2 2280 M-Key x 2 (PCIe Gen 4.0 [x4])SATA 6Gb/s x 1M.2 3052 B-Key x 1Nano SIM Slot x 9 |
Wireless | Wi-Fi 6 |
Supply Voltage | DC 12-36 V Lockable |
Operating temperature | 0°C ~ 60°C |
External Dimensions (mm) | 120.35 x 122.5 |
Certificates | " |
CE/FCC class A" | Supported Operating Systems |