The ET975 COM Express Module Computer is based on an ultra-low voltage 7th Generation Intel® Core™ i7/i5/i3 processor (Kaby Lake-U) manufactured using 14 nanometer manufacturing process technology. Rated for product life, performance calculation and low power consumption cd/m², the ET975 is suitable for applications found in factory automation, kiosk, communications, medical imaging and digital signage environments.
ET975 comes with features that ensure high performance and reliable operation in a wide range of industrial and Embedded applications. ET975 COM Express Type 6 compact module, two DDR4-2133 SO-DIMM sockets with 32GB RAM capacity, 0°C
The motherboard supports IBASE IP413 COM Express ATX carrier board with Type 6 pinout and I/Os for 24-bit dual-channel LVDS, IOS, quad USB 3.0, quad USB 2.0 and HD audio with Realtek ALC662 codec. The module also includes an integrated Trusted Platform Module (TPM)
Product Code | ET975K-i3 (MOQ) |
Form Factor | COM Express Compact Size Type 10 |
Card Size (mm) | 95 x 95 |
Processor [CPU] | Intel® Core™ i5-7300U 2 Core 2.60 GHz BM : 3700 |
Processor [CPU] Family | Intel® Core™ i5 7. Gen |
RAM [System Memory] | [Max 32 GB] |
SSD/HDD/mSATA/M.2 | eMMC | SATA3 x 2 |
LAN/Ethernet | GbE x 1 |
USB 3.0 | x 4 |
USB 2.0 | x 8 |
RS 232 Serial Port | x 2 |
RS 232/422/485 Serial Port | x 1 |
Video Output | LVDS x 1 |
LVDS | 24 bit 1CH x 1 |
Expansion Slot | PCIe [x1] x 4 | PCIe [x4] x 1 | PCIe [x1] x 4 | PCIe [x4] x 1 |
Supply voltage | DC 3.3V |
Certificates | CE |