ET839 ETX module supports industrial wide temperature (-40°C ~ +85°C) and low heat dissipation efficiency, making it ideal for use in Fanless applications in harsh environments. It is powered by a 1.91GHz quad-core Intel® Atom™ Processor E3845 SoC with scalable performance that enables simple replacement or upgrade of existing Bay Trail-I ETX solutions without changing the base board, regardless of platform, chassis and thermal designs.

The ET839 ETX module also offers customers the flexibility to design different carrier boards with different I/O interfaces, offering specific connectors and functionality for their needs and reducing time to market.

The new ET839 (95 x 114mm) supports up to 8GB DDR3L SO-DIMM system memory. Integrated graphics provide dual independent displays via 24-bit dual channel LVDS and CRT graphics outputs with resolutions up to 1600 x 1200 and 2048 x 1536 respectively. to be provided