The COM-RAPC6 is a COM Express Type 6 Compact Size module that harnesses the power of the 13th Generation Intel® Core™ i7/i5/i3 Processor SoC, designed to deliver high-performance computing for a wide range of embedded applications. With a maximum TDP of 45W, this module provides a balance of performance and power efficiency, making it ideal for industrial control, medical devices, and automation systems.

This compact board supports up to 64GB of DDR5 memory via two SODIMM slots, ensuring fast data processing and seamless multitasking for demanding tasks. Its Intel i226 2.5GbE interface provides high-speed network connectivity, enabling rapid data transfer in industrial networks and IoT environments.

The COM-RAPC6 offers a wide range of I/O options, including four USB 3.2 Gen2 ports and eight USB 2.0 ports, allowing for versatile peripheral connectivity. Additionally, it supports two SATA 6.0Gbps interfaces for fast and reliable storage solutions, making it suitable for data-intensive applications.

For expansion, the board supports up to six PCIe devices, allowing integration with a variety of components, including additional storage or specialized cards for industrial applications. The 12V DC input ensures stable power delivery, making the module versatile for various power environments.

With its compact size of 95 x 95mm, the COM-RAPC6 is designed for space-constrained systems where high performance is required. The COM Express Type 6 form factor ensures compatibility with a wide range of carrier boards, making it adaptable for different embedded applications.

In summary, the COM-RAPC6 is a powerful and flexible COM Express module, offering robust computing performance, extensive I/O options, and efficient power usage, all in a compact form factor, making it an excellent solution for industrial and embedded systems.

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