The ET970 COM Express module supports 7th generation Intel® Core™ SoC processors (codenamed Kaby Lake). It is built around the Intel CM238/QM175 chipset, providing increased I/O performance to match the benefits of the latest mobile Intel® Core™ processors manufactured using the optimized 14nm manufacturing process.
IBASE offers three versions of compact ET970 COM Express modules, specifically with processors such as Intel® Core™ i7 7820EQ (3.0GHz ~ 3.5GHz), Intel® Core™ i5 7440EQ (2.9GHz ~ 3.6GHz) and Intel® Core™ i3 7100E (2 ,9GHz). All models support previous DDR3 technology
The Computer-in-Module (COM) design meets the requirements for faster time to market, scalability and flexible mechanical configuration by using a processor module and a separate dedicated carrier board for I/O and external connectors. ET970, Type-6pi
Measuring 95 mm by 125 mm, the ET970 is optionally equipped with a heat spreader and is an ideal solution for automation, retail, medical, gaming, military or aerospace applications.
Product Code | ET970K-X3G |
Form Factor | COM Express Type 10 |
Card Size (mm) | 95 x 125 |
Processor [CPU] | Intel® Xeon® E3-1505 v6 4 Core 3.00 GHz | BM : 7550 |
Processor [CPU] Family | Intel® Xeon® |
RAM [System Memory] | [Max 32 GB] |
SSD/HDD/mSATA/M.2 | SATA3 x 4 |
LAN/Ethernet | GbE x 1 |
USB 3.0 | x 4 |
USB 2.0 | x 8 |
RS 232 Serial Port | x 2 |
RS 232/422/485 Serial Port | x 1 |
Digital I/O | DI x 4 / DO x 4 |
Video Output | LVDS x 1 |
LVDS | 24 bit 1CH x 1 |
Expansion Slot | PCIe [x1] x 8 | PCIe [x16] x 1 | PCIe [x1] x 8 | PCIe [x16] x 1 |
Supply Voltage | DC 3.3 V |
Certificates | CE |