ET970K-X3G

Brand: IBASE
Categories: COM Express Compact Size

The ET970 COM Express module supports 7th generation Intel® Core™ SoC processors (codenamed Kaby Lake). It is built around the Intel CM238/QM175 chipset, providing increased I/O performance to match the benefits of the latest mobile Intel® Core™ processors manufactured using the optimized 14nm manufacturing process.

IBASE offers three versions of compact ET970 COM Express modules, specifically with processors such as Intel® Core™ i7 7820EQ (3.0GHz ~ 3.5GHz), Intel® Core™ i5 7440EQ (2.9GHz ~ 3.6GHz) and Intel® Core™ i3 7100E (2 ,9GHz). All models support previous DDR3 technology

The Computer-in-Module (COM) design meets the requirements for faster time to market, scalability and flexible mechanical configuration by using a processor module and a separate dedicated carrier board for I/O and external connectors. ET970, Type-6pi

Measuring 95 mm by 125 mm, the ET970 is optionally equipped with a heat spreader and is an ideal solution for automation, retail, medical, gaming, military or aerospace applications.


Features


Product Code ET970K-X3G
Form Factor COM Express Type 10
Card Size (mm) 95 x 125
Processor [CPU] Intel® Xeon® E3-1505 v6 4 Core 3.00 GHz | BM : 7550
Processor [CPU] Family Intel® Xeon®
RAM [System Memory] [Max 32 GB]
SSD/HDD/mSATA/M.2 SATA3 x 4
LAN/Ethernet GbE x 1
USB 3.0 x 4
USB 2.0 x 8
RS 232 Serial Port x 2
RS 232/422/485 Serial Port x 1
Digital I/O DI x 4 / DO x 4
Video Output LVDS x 1
LVDS 24 bit 1CH x 1
Expansion Slot PCIe [x1] x 8 | PCIe [x16] x 1 | PCIe [x1] x 8 | PCIe [x16] x 1
Supply Voltage DC 3.3 V
Certificates CE