The ET839 ETX module supports industrial wide temperature (-40°C ~ +85°C) and low heat dissipation efficiency, making it ideal for use in Fanless applications in harsh environments. The platform is powered by the 1.91GHz Quad-Core Intel® Atom™ Processor E3845 SoC with scalable performance, allowing simple replacement or upgrade of existing Bay Trail-I ETX solutions without changing the base board, regardless of chassis and thermal designs.

The ET839 ETX module also offers customers the flexibility to design different carrier boards with different I/O interfaces, providing custom connectors and functions for their needs, thus reducing time to market.

The new ET839 (95 x 114 mm) supports up to 8GB of DDR3L SO-DIMM system memory. Integrated graphics enable dual independent displays via 24-bit dual-channel LVDS and CRT graphics outputs with resolutions up to 1600 x 1200 and 2048 x 1536 respectively. will be provided